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• W2020393910 abstract "Nanocrystalline Cu films were prepared by electric brush-plating. Microstructure characterization by X-diffraction analysis and transmission electron microscope reveals that the average grain size of the nanocrystalline Cu films increases from 24.4 to 150.5 nm with decreases in current density and concentration of Cu ions in bath. A number of growth twins are observed at lower current density and concentration of Cu ions. The results reveal that the nanocrystalline Cu films with wider ranges of grain size and/or high content of growth twins can be prepared by brush-plating technique with suitable controls of current density and concentration of Cu ions in bath." @default.
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• W2020393910 date "2012-01-01" @default.
• W2020393910 modified "2023-09-23" @default.
• W2020393910 title "Preparation of Nanocrystalline Cu Films by Brush-Plating" @default.
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• W2020393910 doi "https://doi.org/10.1080/10584587.2012.687266" @default.
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