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- W2020445955 abstract "Thermal performance is very important to power devices. Solder voids are detrimental to power devices thermal and reliability characteristics. According to above-mentioned problem, using computer software as an analysis tool, making some simulation and modeling on the influence of different solder voids distribution to power devices thermal characteristics. Focus on the solder voids around active region of power devices. Computing results show that solder voids under active region are the most evidently factor to power devices thermal characteristics and provide some suggests on the process of power devices thermal design." @default.
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- W2020445955 date "2014-02-01" @default.
- W2020445955 modified "2023-09-27" @default.
- W2020445955 title "Impacts of Solder Voids on Power Devices' Thermal Characteristics" @default.
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- W2020445955 doi "https://doi.org/10.4028/www.scientific.net/amm.509.70" @default.
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