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- W2020797163 abstract "We present current development efforts on hybrid photonic integration for new generation faster and greener Tb/scapacityoptical networks. On the physical layer, we present the development of a versatile, silicon-based photonicintegration platform that acts as a technology blender bringing together different material systems including III-V andsilicon-based semiconductors. The platform is also used to implement the so-called O-to-O (optical-to-optical)functionalities by patterning low-loss passive components such as MMI couplers and delay interferometers. With thesepassive building blocks as well as the ability for hybrid assembly of active material, we demonstrate the fabrication ofkey optical transport and routing devices such as optical demodulators and all-optical wavelength converters. Thesedevices can now be used to fabricate chip-scale 100 GbE transceiver PICs and Tb/s-capacity wavelength switchingplatforms." @default.
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- W2020797163 date "2011-02-10" @default.
- W2020797163 modified "2023-09-23" @default.
- W2020797163 title "Hybrid photonic integrated circuits for faster and greener optical communication networks" @default.
- W2020797163 doi "https://doi.org/10.1117/12.876824" @default.
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