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• W2020821750 abstract "This paper focuses on the performance of IPM (Intelligent Power Module) under power cycling test which is simulated by a FEA (Finite Element Analysis) method. Through the method of control variables some key parameters about the module's thermal and structure properties can be obtained. The key parameters in the calculation include power dissipation of silicon chip, cycle period, different materials of ceramic substrate and solder layer thickness. A series of factors are adopted in the simulation to evaluate the influence of power cycling test on IPM. The disciplinary conclusion can be a suggestion for package design." @default.
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• W2020821750 date "2014-05-01" @default.
• W2020821750 modified "2023-09-27" @default.
• W2020821750 title "A simulation of Intelligent Power Module under power cycling condition" @default.
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• W2020821750 doi "https://doi.org/10.1109/icept.2014.6922819" @default.
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