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- W2021007918 abstract "Abstract New applications in microelectronics need the integration of high capacitance devices. One way of this development is the integration of capacitors with 3D architecture such as trench fields. The challenge is then to deposit the dielectric material in a highly conformal way within trenches showing high aspects ratios. We have studied and modeled the conformality and the loading effect of Ta 2 O 5 deposited by MOCVD in an analytical way." @default.
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- W2021007918 date "2007-04-01" @default.
- W2021007918 modified "2023-09-23" @default.
- W2021007918 title "High-K dielectric deposition in 3D architectures: The case of Ta2O5 deposited with metal–organic precursor TBTDET" @default.
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- W2021007918 doi "https://doi.org/10.1016/j.microrel.2007.01.066" @default.
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