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- W2021145105 abstract "A new approach of Cu-Ni substrate is reported, where the cubic textured Cu tape was fabricated by thermal-mechanical process, then a Ni layer was electro-deposited on the cubic textured Cu substrate. This approach is also suitable for fabricating long cubic textured metallic substrate for coated conductors. The formation of substrate texture and its thermal stability were investigated by XRD. After electro-depositing Ni layer, the sample has sharper cubic texture with ω = 5.2o and φ = 7.1o, and samples’ texture becames even better (ω = 5 o and φ = 5.2o) after annealing at 950°C for 30min." @default.
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- W2021145105 date "2007-05-01" @default.
- W2021145105 modified "2023-10-06" @default.
- W2021145105 title "New Cu-Ni Substrate for Coated Conductors" @default.
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- W2021145105 doi "https://doi.org/10.4028/www.scientific.net/msf.546-549.1877" @default.
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