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- W2021503011 abstract "A dual-side cooling topology is proposed that is achieved by embedding a power insert into the organic substrate of a chip or chip stack. The power insert consists of vertical copper lamellas supporting lateral current feed in addition to vertical heat dissipation at minimal electrical and thermal gradients. The lateral current feed capability is key to enable the introduction of the cold plate on the bottom side of the substrate. Thermal and electrical finite-element modeling was performed to determine the optimal pitch of the power insert lamella of 270 μm and 350 μm to obtain a total thermal resistance of 21 K-mm <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sup> /W and a voltage drop of 2 mV, respectively. The 10 × 10 mm <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sup> power inserts are fabrication by means of a copper and prepreg lamination process, followed by a sawing and polishing singulation step. The embedding of the power insert is described, considering additional redistribution layers to accommodate also smaller interconnect pitches on the chip side. The effective thermal conductivity of the power insert was derived by bulk-thermal measurement and yielded 320±50 W/m-K, ten times the performance of state-of-the-art substrates with thermal via arrays. Finally, we demonstrate the benefits of the dual-side cooling approach in a thermal benchmark study that compares it with back- and front-side cooling. Dual-side cooling not only halfs the total thermal resistance, but also enables the integration of pyramid-like chip stacks and the placement of high-power dies in the bottom tiers of a stack." @default.
- W2021503011 created "2016-06-24" @default.
- W2021503011 creator A5014871465 @default.
- W2021503011 creator A5018698234 @default.
- W2021503011 creator A5021372077 @default.
- W2021503011 creator A5034679430 @default.
- W2021503011 creator A5035310486 @default.
- W2021503011 creator A5037226881 @default.
- W2021503011 creator A5050603257 @default.
- W2021503011 creator A5068256424 @default.
- W2021503011 creator A5026036778 @default.
- W2021503011 date "2015-05-01" @default.
- W2021503011 modified "2023-10-13" @default.
- W2021503011 title "Embedded power insert enabling dual-side cooling of microprocessors" @default.
- W2021503011 cites W1971260023 @default.
- W2021503011 cites W2022990346 @default.
- W2021503011 cites W2029612332 @default.
- W2021503011 cites W2057127874 @default.
- W2021503011 cites W2099349614 @default.
- W2021503011 cites W2158969233 @default.
- W2021503011 cites W2162770311 @default.
- W2021503011 cites W2163916248 @default.
- W2021503011 cites W2316601978 @default.
- W2021503011 doi "https://doi.org/10.1109/ectc.2015.7159689" @default.
- W2021503011 hasPublicationYear "2015" @default.
- W2021503011 type Work @default.
- W2021503011 sameAs 2021503011 @default.
- W2021503011 citedByCount "1" @default.
- W2021503011 countsByYear W20215030112017 @default.
- W2021503011 crossrefType "proceedings-article" @default.
- W2021503011 hasAuthorship W2021503011A5014871465 @default.
- W2021503011 hasAuthorship W2021503011A5018698234 @default.
- W2021503011 hasAuthorship W2021503011A5021372077 @default.
- W2021503011 hasAuthorship W2021503011A5026036778 @default.
- W2021503011 hasAuthorship W2021503011A5034679430 @default.
- W2021503011 hasAuthorship W2021503011A5035310486 @default.
- W2021503011 hasAuthorship W2021503011A5037226881 @default.
- W2021503011 hasAuthorship W2021503011A5050603257 @default.
- W2021503011 hasAuthorship W2021503011A5068256424 @default.
- W2021503011 hasConcept C119599485 @default.
- W2021503011 hasConcept C121332964 @default.
- W2021503011 hasConcept C127413603 @default.
- W2021503011 hasConcept C137693562 @default.
- W2021503011 hasConcept C165005293 @default.
- W2021503011 hasConcept C184720557 @default.
- W2021503011 hasConcept C186937647 @default.
- W2021503011 hasConcept C192562407 @default.
- W2021503011 hasConcept C199360897 @default.
- W2021503011 hasConcept C204530211 @default.
- W2021503011 hasConcept C41008148 @default.
- W2021503011 hasConcept C49040817 @default.
- W2021503011 hasConcept C78519656 @default.
- W2021503011 hasConcept C9395851 @default.
- W2021503011 hasConcept C97355855 @default.
- W2021503011 hasConceptScore W2021503011C119599485 @default.
- W2021503011 hasConceptScore W2021503011C121332964 @default.
- W2021503011 hasConceptScore W2021503011C127413603 @default.
- W2021503011 hasConceptScore W2021503011C137693562 @default.
- W2021503011 hasConceptScore W2021503011C165005293 @default.
- W2021503011 hasConceptScore W2021503011C184720557 @default.
- W2021503011 hasConceptScore W2021503011C186937647 @default.
- W2021503011 hasConceptScore W2021503011C192562407 @default.
- W2021503011 hasConceptScore W2021503011C199360897 @default.
- W2021503011 hasConceptScore W2021503011C204530211 @default.
- W2021503011 hasConceptScore W2021503011C41008148 @default.
- W2021503011 hasConceptScore W2021503011C49040817 @default.
- W2021503011 hasConceptScore W2021503011C78519656 @default.
- W2021503011 hasConceptScore W2021503011C9395851 @default.
- W2021503011 hasConceptScore W2021503011C97355855 @default.
- W2021503011 hasLocation W20215030111 @default.
- W2021503011 hasOpenAccess W2021503011 @default.
- W2021503011 hasPrimaryLocation W20215030111 @default.
- W2021503011 hasRelatedWork W2012956325 @default.
- W2021503011 hasRelatedWork W2094693852 @default.
- W2021503011 hasRelatedWork W2115443918 @default.
- W2021503011 hasRelatedWork W2159337632 @default.
- W2021503011 hasRelatedWork W2164107244 @default.
- W2021503011 hasRelatedWork W2327591730 @default.
- W2021503011 hasRelatedWork W2353179748 @default.
- W2021503011 hasRelatedWork W2367275322 @default.
- W2021503011 hasRelatedWork W2726952278 @default.
- W2021503011 hasRelatedWork W3011940019 @default.
- W2021503011 isParatext "false" @default.
- W2021503011 isRetracted "false" @default.
- W2021503011 magId "2021503011" @default.
- W2021503011 workType "article" @default.