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- W2021594019 abstract "Unlike other Micro Electro Mechanical System (MEMS) type devices packaging, MEMS type optical devices require higher standard of packaging technique and careful material selection than any other MEMS type products. A number of attempts and a lot of efforts have been devoted to achieve a reliable MEMS type optical device. In this paper, we have achieved highly reliable MEMS type variable optical attenuator (VOA), which passed the Telcordia reliability standard for optical components, by our advanced packaging process and careful reliability considerations in the initial product design step. Our advanced packaging process includes, ultra fine optical fibre alignment on the MEMS chip, securing the aligned optical fibre and hermetic sealing technique. This paper will discuss above advanced packaging issues in detail and reliability test result of the device fabricated according to the developed packaging method." @default.
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- W2021594019 date "2004-01-24" @default.
- W2021594019 modified "2023-09-23" @default.
- W2021594019 title "Packaging considerations for reliability of electrically controlled MEMS VOA" @default.
- W2021594019 doi "https://doi.org/10.1117/12.524603" @default.
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