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- W2021647035 abstract "Abstract A (Pb, Sn)Te thermoelectric (TE) material coated with a Ni barrier layer and a Ag reaction layer was bonded with a Ag-coated Cu electrode at low temperatures in the range of 175–250 °C with an In thin film. The In film reacted initially with the Ag layer to form a double layer of Ag3In and Ag2In intermetallic compounds, which then completely reacted with the Ag layer to form a Ag3In intermetallics layer having a melting point of 690 °C. The resulting module can thus be applied at the optimized operation temperature of (Pb, Sn)Te material (400 °C). The bonding strengths ranged from 6.3 to 7.8 MPa for various bonding temperatures at 30 min, and shear tests revealed that the specimens fractured along the interface between the (Pb, Sn)Te thermoelectric element and the Ni barrier layer. The adhesion of the TE/Ni interface was improved through pre-electroplating a 1 μm Sn film on the surface of the thermoelectric element and heating at 250 °C for 3 min. In this case, the bonding strengths increased to values between 10.9 MPa and 13.2 MPa for a bonding time of 30 min at temperatures ranging from 175 to 250 °C, and in shear tested TE modules, fracture occured in the interior of the TE elements. After high-temperature storage at 400 °C for 200 h, the shear strengths of TE/Cu joints bonded at various temperatures for 30 min decreased to values of 10.5–10.8 MPa, and the fracture occurred in the Ni3Sn4 intermetallics at the (Pb, Sn)Te/Ni interfaces." @default.
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- W2021647035 date "2014-11-01" @default.
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- W2021647035 title "Improvement of bonding strength of a (Pb,Sn)Te–Cu contact manufactured in a low temperature SLID-bonding process" @default.
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- W2021647035 doi "https://doi.org/10.1016/j.jallcom.2014.06.020" @default.
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