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• W2021692713 startingPage "924" @default.
• W2021692713 abstract "Homogeneous intermetallic compound joints are demanded by the semiconductor industry because of their high melting point. In the present work, ultrasonic vibration was applied to Cu/Sn foil/Cu interconnection system at room temperature to form homogeneous Cu6Sn5 and Cu3Sn joints. Compared with other studies based on transient-liquid-phase soldering, the processing time of our method was dramatically reduced from several hours to several seconds. This ultrarapid intermetallic phase formation process resulted from accelerated interdiffusion kinetics, which can be attributed to the sonochemical effects of acoustic cavitation at the interface between the liquid Sn and the solid Cu during the ultrasonic bonding process." @default.
• W2021692713 created "2016-06-24" @default.
• W2021692713 creator A5012009678 @default.
• W2021692713 creator A5050914647 @default.
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• W2021692713 date "2014-05-01" @default.
• W2021692713 modified "2023-09-24" @default.
• W2021692713 title "Ultrarapid formation of homogeneous Cu6Sn5 and Cu3Sn intermetallic compound joints at room temperature using ultrasonic waves" @default.
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• W2021692713 doi "https://doi.org/10.1016/j.ultsonch.2013.09.020" @default.
• W2021692713 hasPubMedId "https://pubmed.ncbi.nlm.nih.gov/24279981" @default.
• W2021692713 hasPublicationYear "2014" @default.
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