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- W2021922585 abstract "본 논문에서는 고속 디지털 회로에서 발생하는 SSN(Simultaneous Switching Noise)을 억제하기 위한 자성 재료가 적용된 복합형 EBG(Electromagnetic Bandgap) 구조의 전원면을 제안하였다. 제안된 EBG 구조는 정사각형 패치와 나선형 선로로 구성된 단위 셀이 주기적으로 연결되어 있으며, 자성 재료는 EBG 구조의 단위 셀 위에 국부적으로 적용되었다. 자성 재료의 투자율 실수 성분은 EBG 단위 셀 사이의 유효 인덕턴스를 중가시켜 밴드갭을 낮은 주파수로 이동시키고, 자성 손실 특성을 갖는 허수 성분은 단위 셀 사이에서 야기되는 기생 LC 공진의 피크값을 낮춘다. 그 결과 제안된 구조는 기존 EBG 구조에 비해 낮은 차단 주파수 특성을 가지며, -30 dB 저지 대역을 기준으로 175 MHz에서 7.7 GHz까지 넓은 억제 대역폭을 나타냈다. 제안된 구조는 전원 무결성 개선 및 EBG 전원면 소형화에 크게 기여할 것으로 기대된다. In this paper, a new composite electromagnetic bandgap(EBG) structure using magnetic materials is proposed for simultaneous switching noise(SSN) suppression in the high-speed digital circuits. The proposed EBG structure has periodic unit cells of square-patches connected by spiral-shaped bridges. The magnetic materials are located on the unit cells of spiral-shaped EBG. The real part of the permeability shifts bandgap to the lower frequency region due to the increased effective inductance. The imaginary part of the permeability has magnetic loss that decreases parasitic LC resonance peaks from between the unit cells. As a result, the proposed structure has the lower cut-off frequency compared with conventional EBG structure and -30 dB SSN suppression bandwidth from 175 MHz to 7.7 GHz. The proposed structure is expected to improve the power integrity and reduce the size of the EBG power plane." @default.
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- W2021922585 date "2008-08-31" @default.
- W2021922585 modified "2023-10-18" @default.
- W2021922585 title "Composite EBG Power Plane Using Magnetic Materials for SSN Suppression in High-Speed Digital Circuits" @default.
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- W2021922585 doi "https://doi.org/10.5515/kjkiees.2008.19.8.933" @default.
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