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• W2022126819 abstract "A comparative study of Ti and TiN [ion beam assisted deposition (IBAD)] films as diffusion barriers for Cu has been done. It is found that amorphous Ti (a-Ti) and TiN (a-TiN) films show better thermal stability than (010) oriented Ti (c-Ti) and (111) oriented TiN (c-TiN) films. Such thermal stability can be attributed to their microstructure lacking grains that are fast diffusion paths compared to the imperfect preferentially oriented films prepared by IBAD. Compared to a 300 Å amorphous TiN layer, a 600 Å c-Ti/a-TiN multilayer shows inferior thermal stability, while improvement resulting from the 600 Å a-Ti/a-TiN multilayer is observed. Reasons for these effects are discussed." @default.
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• W2022126819 date "2000-09-01" @default.
• W2022126819 modified "2023-10-16" @default.
• W2022126819 title "Ti, TiN, and Ti/TiN thin films prepared by ion beam assisted deposition as diffusion barriers between Cu and Si" @default.
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• W2022126819 doi "https://doi.org/10.1116/1.1288942" @default.
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