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• W2022135208 abstract "As the use of anisotropic conductive films (ACFs) in flex-on-board bonding has increased recently, the need for high-speed bonding for higher productivity has developed. For high-speed bonding, a fast-curable acrylic resin has been used instead of an epoxy resin, and ultrasonic (US) bonding is introduced to allow for short bonding time at high bonding temperatures. However, it is possible for fast curable acrylic ACFs at 250°C to be fully cured before the resins flow out sufficiently between the electrodes. In such cases, the ACF joints could show poor electrical characteristics due to there being no conductive particle capture. Therefore, in this paper, in order to understand important factors for high-speed bonding, the effects of the bonding parameters, substrate geometry, and ACF material property on the ACF joint characteristics, such as resin flow and joint resistance, are investigated using acrylic-based ACFs and US bonding. The fast-curable acrylic resin is fully cured at a bonding temperature of 250°C within 1 s. However, the ACF joints bonded at 250°C show joint gaps larger than the diameter of conductive particles, i.e., 8 μm, due to insufficient resin flow and open failure due to no particle capture. As the bonding pressure increases from 2 to 4 MPa, the ACF joint gap at 250°C is smaller than the conductive particle size, and the joint resistance reaches about 20 mΩ within 7 s when using 3-mm-long electrodes and a high-viscosity resin. However, in order to use a shorter bonding time and the common bonding pressure of 3 MPa, the effects of substrate geometry and resin property on ACF joint characteristics are investigated. As the electrode length of the substrates are decreased from 3 to 1 mm, the ACF joints show stable ACF joint gaps and joint resistance at 3 MPa despite the bonding temperature of 250°C applied within 1 s. In terms of the ACF resin properties, when a resin with low minimum viscosity is used, the ACF joint gaps are smaller than the diameter of the conductive particles. Furthermore, the joint resistance of low-minimum-viscosity ACF is more stable than that of the ACF joints bonded with the high-minimum-viscosity resin at 250°C within 1 s, even though a 3-mm-long electrode is used. These results indicate that the substrate geometry of the printed circuit board and the ACF resin viscosity are significant factors for high-speed bonding to obtain stable ACF joints at a high bonding temperature of 250°C within 1 s." @default.
• W2022135208 created "2016-06-24" @default.
• W2022135208 creator A5006085559 @default.
• W2022135208 creator A5026879812 @default.
• W2022135208 creator A5030664816 @default.
• W2022135208 date "2013-01-01" @default.
• W2022135208 modified "2023-09-27" @default.
• W2022135208 title "Effects of ACF Bonding Parameters on ACF Joint Characteristics for High-Speed Bonding Using Ultrasonic Bonding Method" @default.
• W2022135208 cites W2025829793 @default.
• W2022135208 cites W2129795759 @default.
• W2022135208 cites W2134594909 @default.
• W2022135208 cites W2139557413 @default.
• W2022135208 cites W2147694861 @default.
• W2022135208 cites W2170560481 @default.
• W2022135208 cites W2363009981 @default.
• W2022135208 doi "https://doi.org/10.1109/tcpmt.2012.2224661" @default.
• W2022135208 hasPublicationYear "2013" @default.
• W2022135208 type Work @default.
• W2022135208 sameAs 2022135208 @default.
• W2022135208 citedByCount "10" @default.
• W2022135208 countsByYear W20221352082014 @default.
• W2022135208 countsByYear W20221352082015 @default.
• W2022135208 countsByYear W20221352082016 @default.
• W2022135208 countsByYear W20221352082018 @default.
• W2022135208 countsByYear W20221352082019 @default.
• W2022135208 countsByYear W20221352082021 @default.
• W2022135208 countsByYear W20221352082022 @default.
• W2022135208 crossrefType "journal-article" @default.
• W2022135208 hasAuthorship W2022135208A5006085559 @default.
• W2022135208 hasAuthorship W2022135208A5026879812 @default.
• W2022135208 hasAuthorship W2022135208A5030664816 @default.
• W2022135208 hasConcept C111368507 @default.
• W2022135208 hasConcept C127313418 @default.
• W2022135208 hasConcept C127413603 @default.
• W2022135208 hasConcept C140013486 @default.
• W2022135208 hasConcept C159985019 @default.
• W2022135208 hasConcept C166595027 @default.
• W2022135208 hasConcept C18555067 @default.
• W2022135208 hasConcept C192562407 @default.
• W2022135208 hasConcept C2778517922 @default.
• W2022135208 hasConcept C2781448156 @default.
• W2022135208 hasConcept C66938386 @default.
• W2022135208 hasConceptScore W2022135208C111368507 @default.
• W2022135208 hasConceptScore W2022135208C127313418 @default.
• W2022135208 hasConceptScore W2022135208C127413603 @default.
• W2022135208 hasConceptScore W2022135208C140013486 @default.
• W2022135208 hasConceptScore W2022135208C159985019 @default.
• W2022135208 hasConceptScore W2022135208C166595027 @default.
• W2022135208 hasConceptScore W2022135208C18555067 @default.
• W2022135208 hasConceptScore W2022135208C192562407 @default.
• W2022135208 hasConceptScore W2022135208C2778517922 @default.
• W2022135208 hasConceptScore W2022135208C2781448156 @default.
• W2022135208 hasConceptScore W2022135208C66938386 @default.
• W2022135208 hasLocation W20221352081 @default.
• W2022135208 hasOpenAccess W2022135208 @default.
• W2022135208 hasPrimaryLocation W20221352081 @default.
• W2022135208 hasRelatedWork W1586530004 @default.
• W2022135208 hasRelatedWork W1986719603 @default.
• W2022135208 hasRelatedWork W2011840216 @default.
• W2022135208 hasRelatedWork W2026672736 @default.
• W2022135208 hasRelatedWork W2056918901 @default.
• W2022135208 hasRelatedWork W2062115661 @default.
• W2022135208 hasRelatedWork W2064184580 @default.
• W2022135208 hasRelatedWork W2120481327 @default.
• W2022135208 hasRelatedWork W2129795759 @default.
• W2022135208 hasRelatedWork W2147694861 @default.
• W2022135208 hasRelatedWork W2152816169 @default.
• W2022135208 hasRelatedWork W2162376602 @default.
• W2022135208 hasRelatedWork W2168439491 @default.
• W2022135208 hasRelatedWork W2354912929 @default.
• W2022135208 hasRelatedWork W2379150622 @default.
• W2022135208 hasRelatedWork W2541835363 @default.
• W2022135208 hasRelatedWork W2545227014 @default.
• W2022135208 hasRelatedWork W2753241409 @default.
• W2022135208 hasRelatedWork W933484612 @default.
• W2022135208 hasRelatedWork W2927476598 @default.
• W2022135208 isParatext "false" @default.
• W2022135208 isRetracted "false" @default.
• W2022135208 magId "2022135208" @default.
• W2022135208 workType "article" @default.