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- W2022165416 abstract "Thick film screen printing technology is able to reach a pitch of 250 μm. In an attempt to achieve lower values, two approaches have been developed so far. Both are based on the combination of screen printing as a deposition technique and photolithography for the patterning. The first approach uses photoimageable conductor and dielectric pastes; the second is based on photoimageable dielectric and etching of the fired conductor. In order to obtain a full characterisation of both processes, a test module was designed and manufactured by using the first process and identical test modules were provided by the supplier using the second technology. The design of the test module is based on a two‐layer interconnection pattern including structures for testing cross‐overs, via interconnections with various resolutions (down to 50 μm via size), in order to investigate the limits of these technologies. This paper gives a comparison of these two approaches based on the results of electrical and mechanical measuremen..." @default.
- W2022165416 created "2016-06-24" @default.
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- W2022165416 date "1996-12-01" @default.
- W2022165416 modified "2023-10-10" @default.
- W2022165416 title "Interconnection Technology for Advanced High Density Thick Films" @default.
- W2022165416 doi "https://doi.org/10.1108/13565369610800322" @default.
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