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- W2022255912 abstract "Bottom-up alternative lithographic masks from directed self-assembly systems have been extending the limits of criticaldimensions in a cost-effective manner although great challenges in controlling defectivity remain open. Particularly,defectivity and dimensional metrology are two main challenges in lithography due to the increasing miniaturisation ofcircuits. To gain insights about the percentage of alignment, defectivity and order quantification, directed self-assemblyblock copolymer fingerprints were investigated via an image analysis methodology. Here we present the analysis ofhexagonal phase of polystyrene-b-polydimethylsiloxane (PS-b-PDMS) forming linear patterns in topological substrates.From our methodology, we have performed dimensional metrology estimating pitch size and error, and the linewidth ofthe lines was estimated. In parallel, the methodology allowed us identification and quantification of typical defectsobservable in self-assembly, such as turning points, disclination or branching points, break or lone points and end points.The methodology presented here yields high volume statistical data useful for advancing dimensional metrology anddefect analysis of self- and directed assembly systems." @default.
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- W2022255912 date "2015-03-27" @default.
- W2022255912 modified "2023-10-08" @default.
- W2022255912 title "Mapping self-assembled dots and line arrays by image analysis for quantification of defect density and alignment" @default.
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- W2022255912 doi "https://doi.org/10.1117/12.2085748" @default.
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