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• W2022272044 abstract "The flip-chip technology has many advantages over standard wire bonding processes especially as interconnection technique for MEMS operating in harsh environments. In this paper, silver based micro contact bumps are investigated with test assemblies on their reliability for an operating temperature of 500 °C. The contact bump materials are a nano-silver sinter paste and a glass-solder filled with silver particles. Our experiments showed an optimal mixture ratio of silver and glass of 80/20 with regard to stability and electrical performance of the contact material. Silicon based test-chips mounted on Al2O3, AlN and Si3N4 substrates, metallized with platinum were the test devices for process optimization and reliability measurements. The stability and electrical performance of the contact materials were investigated. We used an analytical approach to identify material and process parameters that influence the stress inside a contact bump after processing. Our experimental results indicate a high influence of the sensor substrate CTE and the process temperature on the lifetime in the micro contact. After processing the test-assemblies were exposed to extreme thermal shock cycles with ΔT = 470 K. We analyzed the lifetime of the micro contacts during the cycles with in-situ resistance measurements of the test-structures. Sintered silver and conductive glass contacts are both promising high-temperature flip-chip interconnections. Longer lifetimes of contact bumps with sintered silver were detected. We observed early contact failures after 10 to 20 thermal shocks for the devices with Al2O3 and AlN substrates. A test assembly contacted by silver-sintering on Si3N4 had the first contact failure after 54 thermal shock cycles." @default.
• W2022272044 created "2016-06-24" @default.
• W2022272044 creator A5029691901 @default.
• W2022272044 creator A5053187487 @default.
• W2022272044 creator A5068301274 @default.
• W2022272044 creator A5081719215 @default.
• W2022272044 date "2013-05-01" @default.
• W2022272044 modified "2023-09-27" @default.
• W2022272044 title "Reliability of flip-chip technologies for SiC-MEMS operating at 500 &#x00B0;C" @default.
• W2022272044 cites W1509684708 @default.
• W2022272044 cites W1974761627 @default.
• W2022272044 cites W2076531024 @default.
• W2022272044 cites W2086464390 @default.
• W2022272044 cites W2100822548 @default.
• W2022272044 cites W2101145206 @default.
• W2022272044 cites W2103632388 @default.
• W2022272044 cites W2118186978 @default.
• W2022272044 cites W2124770049 @default.
• W2022272044 cites W2153816431 @default.
• W2022272044 cites W2172277242 @default.
• W2022272044 doi "https://doi.org/10.1109/ectc.2013.6575776" @default.
• W2022272044 hasPublicationYear "2013" @default.
• W2022272044 type Work @default.
• W2022272044 sameAs 2022272044 @default.
• W2022272044 citedByCount "2" @default.
• W2022272044 countsByYear W20222720442014 @default.
• W2022272044 countsByYear W20222720442019 @default.
• W2022272044 crossrefType "proceedings-article" @default.
• W2022272044 hasAuthorship W2022272044A5029691901 @default.
• W2022272044 hasAuthorship W2022272044A5053187487 @default.
• W2022272044 hasAuthorship W2022272044A5068301274 @default.
• W2022272044 hasAuthorship W2022272044A5081719215 @default.
• W2022272044 hasConcept C111368507 @default.
• W2022272044 hasConcept C121332964 @default.
• W2022272044 hasConcept C123671423 @default.
• W2022272044 hasConcept C123745756 @default.
• W2022272044 hasConcept C127313418 @default.
• W2022272044 hasConcept C132235601 @default.
• W2022272044 hasConcept C159985019 @default.
• W2022272044 hasConcept C163258240 @default.
• W2022272044 hasConcept C191281628 @default.
• W2022272044 hasConcept C192562407 @default.
• W2022272044 hasConcept C202374169 @default.
• W2022272044 hasConcept C2777289219 @default.
• W2022272044 hasConcept C2777581544 @default.
• W2022272044 hasConcept C2779227376 @default.
• W2022272044 hasConcept C31258907 @default.
• W2022272044 hasConcept C37977207 @default.
• W2022272044 hasConcept C41008148 @default.
• W2022272044 hasConcept C43214815 @default.
• W2022272044 hasConcept C49040817 @default.
• W2022272044 hasConcept C50296614 @default.
• W2022272044 hasConcept C544956773 @default.
• W2022272044 hasConcept C62520636 @default.
• W2022272044 hasConcept C68928338 @default.
• W2022272044 hasConcept C79072407 @default.
• W2022272044 hasConceptScore W2022272044C111368507 @default.
• W2022272044 hasConceptScore W2022272044C121332964 @default.
• W2022272044 hasConceptScore W2022272044C123671423 @default.
• W2022272044 hasConceptScore W2022272044C123745756 @default.
• W2022272044 hasConceptScore W2022272044C127313418 @default.
• W2022272044 hasConceptScore W2022272044C132235601 @default.
• W2022272044 hasConceptScore W2022272044C159985019 @default.
• W2022272044 hasConceptScore W2022272044C163258240 @default.
• W2022272044 hasConceptScore W2022272044C191281628 @default.
• W2022272044 hasConceptScore W2022272044C192562407 @default.
• W2022272044 hasConceptScore W2022272044C202374169 @default.
• W2022272044 hasConceptScore W2022272044C2777289219 @default.
• W2022272044 hasConceptScore W2022272044C2777581544 @default.
• W2022272044 hasConceptScore W2022272044C2779227376 @default.
• W2022272044 hasConceptScore W2022272044C31258907 @default.
• W2022272044 hasConceptScore W2022272044C37977207 @default.
• W2022272044 hasConceptScore W2022272044C41008148 @default.
• W2022272044 hasConceptScore W2022272044C43214815 @default.
• W2022272044 hasConceptScore W2022272044C49040817 @default.
• W2022272044 hasConceptScore W2022272044C50296614 @default.
• W2022272044 hasConceptScore W2022272044C544956773 @default.
• W2022272044 hasConceptScore W2022272044C62520636 @default.
• W2022272044 hasConceptScore W2022272044C68928338 @default.
• W2022272044 hasConceptScore W2022272044C79072407 @default.
• W2022272044 hasLocation W20222720441 @default.
• W2022272044 hasOpenAccess W2022272044 @default.
• W2022272044 hasPrimaryLocation W20222720441 @default.
• W2022272044 hasRelatedWork W1578240350 @default.
• W2022272044 hasRelatedWork W2003125923 @default.
• W2022272044 hasRelatedWork W2009575211 @default.
• W2022272044 hasRelatedWork W2011307966 @default.
• W2022272044 hasRelatedWork W2016478358 @default.
• W2022272044 hasRelatedWork W2017619332 @default.
• W2022272044 hasRelatedWork W2041257144 @default.
• W2022272044 hasRelatedWork W2048963766 @default.
• W2022272044 hasRelatedWork W2111824997 @default.
• W2022272044 hasRelatedWork W2128020848 @default.
• W2022272044 hasRelatedWork W2136197004 @default.
• W2022272044 hasRelatedWork W2177970046 @default.
• W2022272044 hasRelatedWork W2291504218 @default.
• W2022272044 hasRelatedWork W2334946358 @default.
• W2022272044 hasRelatedWork W2528612493 @default.
• W2022272044 hasRelatedWork W2542063097 @default.
• W2022272044 hasRelatedWork W2543803682 @default.

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