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- W2022280638 abstract "Atmospheric pressure non-equilibrium Ar–H2O plasma was irradiated to exfoliate a thin film of a heat-resistant polymer, poly(amide–imide) coating on enamel copper wire. The plasma was produced by applying microwave power inducted with Ar–H2, Ar–O2, Ar–H2O or Ar–H2–O2 mixed gases. The poly(amide–imide) thin film was exfoliate by those plasma irradiations. The magnitude of exfoliation depended on the distance of the copper wire from the plasma generating material and reached a maximum at a distance around 4 cm for each plasma irradiation. Surface conditions of the copper wire varied depending on the inducted gases. Ar–O2 plasma irradiation oxidized the copper surface while other plasmas kept the copper surface unchanged. The time it took to exfoliate the poly(amide–imide) depended on the irradiation source, either Ar–O2 (within 60 s), Ar–H2O (within 70 s), Ar–H2–O2 (within 70 s) or Ar–H2 (within 125 s). The Ar–H2O plasma irradiation under non-equilibrium atmospheric pressure was found to be the best method for exfoliating the poly(amide–imide) thin film coating on enamel copper wires rather than the Ar–H2–O2 plasma because of its simplicity and safety." @default.
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- W2022280638 date "2010-09-01" @default.
- W2022280638 modified "2023-09-27" @default.
- W2022280638 title "Decomposition of poly(amide–imide) film using atmospheric pressure non-equilibrium plasma generated in a stream of H2O/Ar mixed gases" @default.
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- W2022280638 doi "https://doi.org/10.1016/j.tsf.2010.03.043" @default.
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