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- W2022365840 abstract "We developed a novel method for three-dimensional heterogeneous integration of devices based on any semiconductormaterial on a pliant surface with arbitrary surface profile. Arrays of optical detectors in the form of vertically orientedmicro/nano-pillars with diverse bandgaps and physical properties are fabricated via synthetic bottom-up ortransformative top-down approaches on a single crystal surface and then transferred to a different target surface using apolymer assisted shear-fracturing process. The original wafers are used repeatedly for generating more devices and arenever consumed. Ohmic contacts with low contact resistance are formed for individual electrical addressing of eachlayer of sensors using metals and/or conducting polymer such as PAni and PEDOT:PSS. The method offers anopportunity for device fabrication with low fill factor contributing to lower dark current, reduced parasitic capacitanceand higher efficiency of light absorption." @default.
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- W2022365840 date "2009-05-01" @default.
- W2022365840 modified "2023-09-23" @default.
- W2022365840 title "Heterogeneous 3D integration of multi-spectral photonic sensor with highly oriented micro/nano-pillars of semiconductors" @default.
- W2022365840 doi "https://doi.org/10.1117/12.821791" @default.
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