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- W2022503488 abstract "유연 솔더가 실장된 패키지와 무연 솔더가 실장된 패키지의 온도에 따른 변형 거동은 솔더 자체의 물성치 뿐만 아니라 패키지를 구성하는 재료의 물성치에도 큰 영향을 받는다고 알려져 있다. 본 논문에서는 스트레인 게이지의 온도특성을 이용하여 미지 재료의 열팽창계수를 결정하는 방법을 정립하고, 반도체 패키지 몰딩 화합물의 열팽창계수를 실험적으로 구하였다. 탄소강과 알루미늄 시편을 기준 시편으로 사용하고 스트레인 게이지 측정을 통하여 온도에 따른 유연 솔더용 몰딩 화합물과 무연 솔더용 몰딩 화합물의 열팽창계수를 구하고, 무아레 간섭계를 이용하여 비접촉적으로 열팽창 계수를 측정하여 결과를 비교하였다. 기준 시편에 따른 두 가지 스트레인 게이지 실험 결과와 무아레 실험 결과가 잘 일치하여서 실험방법에 신뢰성이 있는 것을 보였다. 유연 솔더용 몰딩 화합물의 경우에는 열팽창계수가 온도에 관계없이 약 <TEX>$15.8ppm/^{circ}C$</TEX>로 측정되었고, 무연 솔더용의 경우에는 <TEX>$100^{circ}C$</TEX>이하의 온도에서 몰딩 화합물의 열팽창계수는 약 <TEX>$9.9ppm/^{circ}C$</TEX>이었으나 <TEX>$100^{circ}C$</TEX>이상에서는 온도가 증가함에 따라 열팽창계수가 급격하게 증가되어 <TEX>$130^{circ}C$</TEX>에서는 <TEX>$15.0ppm/^{circ}C$</TEX>의 값을 가졌다. It is well known that thermal deformation of electronic packages with Pb-Sn solder and with lead-free solder is significantly affected by material properties consisting the package, as well as those of the solder itself. In this paper, the method for determining coefficient of thermal expansion(CTE) of new material is established by using temperature characteristic of strain gages, and the CTE of molding compound are obtained experimentally. The temperature-dependent CTE of molding compound for Pb-Sn solder and that for lead-free solder are obtained by using strain measurements with well known steel specimen and aluminium specimen as reference specimens, and the CTE's are also measured non-contactly by using moire interferometry. Those results are compared, and the agreement between the two types of strain gage experiment and the moire experiment show the strain gage method used in this paper to be reliable. In the case of the molding compound for Pb-Sn solder, the CTE is measured as approximately <TEX>$15.8ppm/^{circ}C$</TEX> regardless of the temperature. In the case for the lead-free solder, the CTE is measured as of approximately <TEX>$9.9ppm/^{circ}C$</TEX> below the temperature of <TEX>$100^{circ}C$</TEX>, and then the CTE is increased sharply depending on the temperature, and reaches to <TEX>$15.0ppm/^{circ}C$</TEX> at <TEX>$130^{circ}C$</TEX>." @default.
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- W2022503488 date "2013-09-30" @default.
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- W2022503488 title "Measurement of Thermal Expansion Coefficient of Package Material Using Strain Gages" @default.
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- W2022503488 doi "https://doi.org/10.6117/kmeps.2013.20.3.037" @default.
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