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- W2022698506 abstract "This work proposes to develop a CMOS (complementary metal oxide semiconductor) capacitive ultrasonic sensor chip that can be jointly operated with an acoustic lens system to achieve fast 3-D photoacoustic imaging. Compared to conventional piezoelectric technology, capacitive transducers have a wider bandwidth and can be miniaturized and fabricated in a dense array to provide better imaging quality. Different from our previous approach that requires a long acquisition time to measure the complete waveform of each sensor for 3-D image reconstruction, the new scheme only has to detect the peak amplitude of a waveform. This paper reports the characterization of the fabricated sensors, which shows the sensors have a resonant frequency near 3.5 MHz and the peak detection errors are typically within ±10% for test signals from 1 to 10 MHz with the amplitude from 50 to 400 mV." @default.
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- W2022698506 date "2016-01-01" @default.
- W2022698506 modified "2023-09-25" @default.
- W2022698506 title "Characterization of 0.18-μm CMOS MEMS Capacitive Ultrasonic Sensors for Fast Photoacoustic Imaging" @default.
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- W2022698506 doi "https://doi.org/10.1016/j.proeng.2016.11.256" @default.
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