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• W2022718149 endingPage "083001" @default.
• W2022718149 startingPage "083001" @default.
• W2022718149 abstract "Automatic wire bonding is a highly mature, cost-efficient and broadly available back-end process, intended to create electrical interconnections in semiconductor chip packaging. Modern production wire-bonding tools can bond wires with speeds of up to 30 bonds per second with placement accuracies of better than , and the ability to form each wire individually into a desired shape. These features render wire bonding a versatile tool also for integrating wires in applications other than electrical interconnections. Wire bonding has been adapted and used to implement a variety of innovative microstructures. This paper reviews unconventional uses and applications of wire bonding that have been reported in the literature. The used wire-bonding techniques and materials are discussed, and the implemented applications are presented. They include the realization and integration of coils, transformers, inductors, antennas, electrodes, through silicon vias, plugs, liquid and vacuum seals, plastic fibers, shape memory alloy actuators, energy harvesters and sensors." @default.
• W2022718149 created "2016-06-24" @default.
• W2022718149 creator A5004612728 @default.
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• W2022718149 creator A5043782835 @default.
• W2022718149 creator A5047998886 @default.
• W2022718149 creator A5085711393 @default.
• W2022718149 date "2013-06-21" @default.
• W2022718149 modified "2023-10-16" @default.
• W2022718149 title "Unconventional applications of wire bonding create opportunities for microsystem integration" @default.
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• W2022718149 doi "https://doi.org/10.1088/0960-1317/23/8/083001" @default.
• W2022718149 hasPublicationYear "2013" @default.
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