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• W2022751783 abstract "Purpose This paper attempts to review recent advances in wire bonding using insulated wire and new challenges in wire bonding for advanced microelectronics packaging. Design/methodology/approach Dozens of journal articles, conference articles and patents published or issued in 2004‐2007 are reviewed. Findings The advantages and problems/challenges related to wire bonding using insulated wire are briefly analysed, and several solutions to the problems and recent findings/developments related to wire bonding using insulated wire are discussed. Research limitations/implications Because of page limitation of the paper, only brief review is conducted. Further reading is needed for more details. Originality/value This paper attempts to provide introduction to recent developments and the trends in wire bonding using insulated wire. With the references provided, readers may explore more deeply by reading the original articles and patent documents." @default.
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• W2022751783 date "2008-04-18" @default.
• W2022751783 modified "2023-09-26" @default.
• W2022751783 title "Wire bonding using insulated wire and new challenges in wire bonding" @default.
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• W2022751783 doi "https://doi.org/10.1108/13565360810875958" @default.
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