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- W2022805610 abstract "This work investigates the thermal interactions of Cu/Ta–N/Ta/fluorinated silicate glass (FSG) structures after annealing up to 900 °C, where Ta–N layers are as-deposited amorphous TaNx (x∼0.5) or polycrystalline TaN films. It is found that both TaNx and TaN barriers possess excellent capability to prevent Cu from diffusing after annealing at 700 °C or lower. After annealing at 800 °C, however, inward diffusion of Cu occurred in Cu/Ta–N/FSG structures. The outward diffusion of fluorine was also observed. After annealing at 900 °C, reaction spots, which exposed the underlying FSG layer, were observed on the surface and formation of oxide phases was detected in the Cu/TaNx/FSG structure. However, exposure of FSG and oxidation were not found in the Cu/TaN/FSG structure. Nevertheless, in Cu/TaN/FSG structure, the sheet resistance was found to increase drastically after annealing at 900 °C. The significant increase in the sheet resistance could be attributed to the agglomeration of Cu. The influences of TaNx and TaN interlayers on the thermal stability of Cu/FSG system are discussed on the basis of chemical composition of these two Ta–N barriers." @default.
- W2022805610 created "2016-06-24" @default.
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- W2022805610 date "2004-12-01" @default.
- W2022805610 modified "2023-09-24" @default.
- W2022805610 title "The thermal stability of Cu/FSG structure with amorphous and crystalline tantalum nitride diffusion barriers" @default.
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- W2022805610 doi "https://doi.org/10.1016/j.tsf.2004.08.138" @default.
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