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- W2022878888 abstract "Printed electronic industry develops fast and has great potential. In order to prepare water-based nano-silver gravure conductive ink used for printed electronics, liquid chemical reduction method is used. Ag + (5.89M) at high concentration acting as the precursor is reduced by hydrazine hydrate with PVP as the protecting agent. For one time of reaction, silver content of 9.25% is obtained. After washing and centrifuging the silver colloids for three times to purity, some amount of deionized water, resin and additives are added to the silver paste to fabricated water-based nano-silver conductive ink for gravure. Then, samples obtained by coating or proofing are dried and surface resistance and adhesion are measured. The results indicated that the silver particles prepared have size of about 50~100nm and most of the particles are spherical with small amount nanoplates. The nano-silver gravure conductive ink has 52.63% silver content and 3.58% PVP. Surface resistance of samples coated after sintering at 120°C for 30s can reach 129.5mΩ/sq and the resistivity is 1.49×10 -4 Ω.cm. The ink layer surface has no drop after 3M method which indicating good adhesion. The ink is suitable for gravure and can be used in printed electronics." @default.
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- W2022878888 date "2012-12-01" @default.
- W2022878888 modified "2023-09-23" @default.
- W2022878888 title "Preparation of Water-Based Nano-Silver Gravure Conductive Ink Used for Printed Electronics" @default.
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- W2022878888 doi "https://doi.org/10.4028/www.scientific.net/amm.262.523" @default.
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