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- W2022896584 abstract "This paper presents an 80 x 60 element thermoelectric infrared focal plane array that provides high responsivity and a low cost/high volume potential. The device has been designed to have a responsivity of 2100 V/W. The overall chip size is 12.2mm x 9.3mm with a 10.4mm x 7.8mm imaging area. Each detector consists of three pairs of p-n polysilicon thermocouples with external dimensions of 130um x 130um and an internal resistance of 90k ohms. The thermal time constant for this device is ≈ 16ms. Compatible with standard CMOS processes this bulk micromachined focal plane array delivers near microbolometer performance making very low cost infrared cameras economically feasible." @default.
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- W2022896584 date "2009-05-01" @default.
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- W2022896584 title "80 x 60 element thermoelectric infrared focal plane array for high-volume commercial use" @default.
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- W2022896584 doi "https://doi.org/10.1117/12.819061" @default.
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