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• W2022975927 abstract "While transistor performance and energy efficiency have dramatically improved in recent years, electrical interconnect improvements has failed to keep pace. Recent advances in nanophotonic fabrication have made on-chip optics an attractive alternative. However, system integration challenges remain. In particular, the parameters of on-chip nanophotonic structures are sensitive to fabrication-induced process variation and run-time spatial thermal variation across the die. This work addresses the performance and reliability challenges that arise from this sensitivity to variation. The paper first presents a model predicting the system-level effects of thermal and process variation in nanophotonic networks. It then shows how to optimize many-core system performance and reliability by using run-time techniques to compensate for the thermal and process variation effects." @default.
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• W2022975927 date "2012-01-01" @default.
• W2022975927 modified "2023-10-13" @default.
• W2022975927 title "Reliability Modeling and Management of Nanophotonic On-Chip Networks" @default.
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• W2022975927 doi "https://doi.org/10.1109/tvlsi.2010.2089072" @default.
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