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- W202322167 abstract "Current PCB power converter construction technologies are based on the utilization of nonstandardized building blocks. Utilization of passive components with various shapes, poor thermal properties and mixed technology mounting (THT and SMT) represents fundamental limit for reaching high power density, effective thermal management, particular form-factor and a low-cost fully automated assembly of power electronic converters. The thesis develops a power electronics construction technology, which utilizes heightstandardized SMT passive components with enhanced thermal properties. This ultimately enables to achieve fully automated SMT assembly at low cost, high power densities and desired form-factor of power converters." @default.
- W202322167 created "2016-06-24" @default.
- W202322167 creator A5040257779 @default.
- W202322167 date "2014-02-24" @default.
- W202322167 modified "2023-09-23" @default.
- W202322167 title "The Power Sandwich: A Three-Dimensional Power Electronics Assembly Technology" @default.
- W202322167 doi "https://doi.org/10.4233/uuid:2a967778-6cb1-45a2-ab90-9cbe1ad030da" @default.
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