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- W2023265483 abstract "As the microelectronic industry moves into the ‘nano-era’, the importance of the interconnections in an integrated circuit is growing tremendously. This paper will address the challenges of connecting billions of active elements in a functional pattern. Achieving the needed performances of this network in terms of connectivity, integration density, performances and manufacturability is a major task where breakthroughs will come possibly from new materials, but surely from the co-development of the technology, of the interconnection architecture and of the design methodology." @default.
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- W2023265483 date "2006-11-01" @default.
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- W2023265483 title "Challenges in advanced metallization schemes" @default.
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- W2023265483 doi "https://doi.org/10.1016/j.mee.2006.09.005" @default.
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