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- W2023376561 abstract "Novel self-aligned hybrid integration of semiconductor lasers with three-dimensional micro-optical components has been demonstrated. The self-alignment structures are fabricated integrally with other three-dimensional micro-optical elements such as micro-Fresnel lenses, mirrors, and gratings on a single Si chip by surface micromachining technology. The Si substrate serves as a free-space micro-optical bench for active and passive optoelectronic components. A divergent beam emitted from an edge-emitting semiconductor laser has been successfully collimated by the integrated micro-Fresnel lens. The integration scheme offers a new approach for optoelectronic packaging and a new technology platform for integrating complete free-space micro-optical system on a single chip." @default.
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- W2023376561 date "1995-05-29" @default.
- W2023376561 modified "2023-09-23" @default.
- W2023376561 title "Self‐aligned hybrid integration of semiconductor lasers with micromachined micro‐optics for optoelectronic packaging" @default.
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- W2023376561 doi "https://doi.org/10.1063/1.114238" @default.
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