Matches in SemOpenAlex for { <https://semopenalex.org/work/W2023429445> ?p ?o ?g. }
Showing items 1 to 85 of
85
with 100 items per page.
- W2023429445 abstract "A Sn-Zn based eutectic solder with a relatively lower melting temperature and cost was under investigation for its response to electrical current stressing. The BGA (ball grid array) joint was produced with the Sn-8.5Zn-0.5Ag-0.01Al-0.1 Ga solder ball. The solder joint was supplied from industry and was produced to interconnect PCB and BGA substrate on which the metallization layers are Cu (30-35 um)/Ni (10 um)/Au (0.21 um). The investigation was conducted under air at 120degC in a furnace with a current density in the order of 10 <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>-3</sup> A/cm <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sup> . Voids were found in th solder near the metallization of the PCB side when the electron flows outward the PCB. Meanwhile, the IMC (AuZn <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>3</sub> and AgZn <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>3</sub> ) formed on the substrate side during reflow was decomposed after current stressing. The decomposition results in the reformation of Zn-Ag-Zu IMC within the solder. Delta-NiZn compound was also detected within the solder, of which the Ni may come from the Cu/Ni/Au metallization layer. The Ni was also found to form NiGa compound within the solder. Hillocks were found for the IMC layer regardless of the direction of electrical current." @default.
- W2023429445 created "2016-06-24" @default.
- W2023429445 creator A5003204587 @default.
- W2023429445 creator A5037218422 @default.
- W2023429445 date "2007-01-01" @default.
- W2023429445 modified "2023-10-18" @default.
- W2023429445 title "The Electromigration Investigation on the Newly Developed Pb-free Sn-Zn-Ag-Al-Ga Solder Ball Interconnect" @default.
- W2023429445 cites W185935660 @default.
- W2023429445 cites W1964600718 @default.
- W2023429445 cites W2004987200 @default.
- W2023429445 cites W2010689236 @default.
- W2023429445 cites W2011384630 @default.
- W2023429445 cites W2012402211 @default.
- W2023429445 cites W2035793312 @default.
- W2023429445 cites W2041698616 @default.
- W2023429445 cites W2049118155 @default.
- W2023429445 cites W2067519125 @default.
- W2023429445 cites W2083428498 @default.
- W2023429445 cites W2086757712 @default.
- W2023429445 cites W2115454393 @default.
- W2023429445 doi "https://doi.org/10.1109/ectc.2007.373989" @default.
- W2023429445 hasPublicationYear "2007" @default.
- W2023429445 type Work @default.
- W2023429445 sameAs 2023429445 @default.
- W2023429445 citedByCount "0" @default.
- W2023429445 crossrefType "proceedings-article" @default.
- W2023429445 hasAuthorship W2023429445A5003204587 @default.
- W2023429445 hasAuthorship W2023429445A5037218422 @default.
- W2023429445 hasConcept C111368507 @default.
- W2023429445 hasConcept C122041747 @default.
- W2023429445 hasConcept C123745756 @default.
- W2023429445 hasConcept C127313418 @default.
- W2023429445 hasConcept C134306372 @default.
- W2023429445 hasConcept C138055206 @default.
- W2023429445 hasConcept C159985019 @default.
- W2023429445 hasConcept C18168003 @default.
- W2023429445 hasConcept C186260285 @default.
- W2023429445 hasConcept C191897082 @default.
- W2023429445 hasConcept C192562407 @default.
- W2023429445 hasConcept C2777289219 @default.
- W2023429445 hasConcept C2780026712 @default.
- W2023429445 hasConcept C31258907 @default.
- W2023429445 hasConcept C33923547 @default.
- W2023429445 hasConcept C41008148 @default.
- W2023429445 hasConcept C49040817 @default.
- W2023429445 hasConcept C50296614 @default.
- W2023429445 hasConcept C530198007 @default.
- W2023429445 hasConcept C94709252 @default.
- W2023429445 hasConceptScore W2023429445C111368507 @default.
- W2023429445 hasConceptScore W2023429445C122041747 @default.
- W2023429445 hasConceptScore W2023429445C123745756 @default.
- W2023429445 hasConceptScore W2023429445C127313418 @default.
- W2023429445 hasConceptScore W2023429445C134306372 @default.
- W2023429445 hasConceptScore W2023429445C138055206 @default.
- W2023429445 hasConceptScore W2023429445C159985019 @default.
- W2023429445 hasConceptScore W2023429445C18168003 @default.
- W2023429445 hasConceptScore W2023429445C186260285 @default.
- W2023429445 hasConceptScore W2023429445C191897082 @default.
- W2023429445 hasConceptScore W2023429445C192562407 @default.
- W2023429445 hasConceptScore W2023429445C2777289219 @default.
- W2023429445 hasConceptScore W2023429445C2780026712 @default.
- W2023429445 hasConceptScore W2023429445C31258907 @default.
- W2023429445 hasConceptScore W2023429445C33923547 @default.
- W2023429445 hasConceptScore W2023429445C41008148 @default.
- W2023429445 hasConceptScore W2023429445C49040817 @default.
- W2023429445 hasConceptScore W2023429445C50296614 @default.
- W2023429445 hasConceptScore W2023429445C530198007 @default.
- W2023429445 hasConceptScore W2023429445C94709252 @default.
- W2023429445 hasLocation W20234294451 @default.
- W2023429445 hasOpenAccess W2023429445 @default.
- W2023429445 hasPrimaryLocation W20234294451 @default.
- W2023429445 hasRelatedWork W1434946709 @default.
- W2023429445 hasRelatedWork W1944346085 @default.
- W2023429445 hasRelatedWork W1996916844 @default.
- W2023429445 hasRelatedWork W2025313931 @default.
- W2023429445 hasRelatedWork W2053291093 @default.
- W2023429445 hasRelatedWork W2126843568 @default.
- W2023429445 hasRelatedWork W2134548947 @default.
- W2023429445 hasRelatedWork W2154548089 @default.
- W2023429445 hasRelatedWork W2167784957 @default.
- W2023429445 hasRelatedWork W4285730403 @default.
- W2023429445 isParatext "false" @default.
- W2023429445 isRetracted "false" @default.
- W2023429445 magId "2023429445" @default.
- W2023429445 workType "article" @default.