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- W2023582455 abstract "The shear strength of the Cr/Cr–Cu/Cu UBM structure in both the high-melting solder bump and low-melting solder bump after aging were evaluated. SEM and TEM were examined in the intermetallic compounds and bump joint profiles at the interface between solder and UBM . The shear load concentrated on the bump was analyzed by finite element method. In 900-hour aging experiments, the maximum shear strength of Sn–97 mass%Pb and Sn–37 mass%Pb decreased by 25% and 20%, respectively. The growth of Cu6Sn5 and Cu3Sn was ascertained by the aging treatment. The crack path changes from the interior of a solder to the intermetallic compound interface was evaluated. Compared with the Cu–Sn IMC, the amount of Ni–Sn IMC was small. The Ni layer is considered as the diffusion barrier." @default.
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- W2023582455 date "2002-01-01" @default.
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- W2023582455 title "Aging Treatment Characteristics of Shear Strength in Micro Solder Bump" @default.
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- W2023582455 doi "https://doi.org/10.2320/matertrans.43.3234" @default.
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