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- W2023798394 abstract "A semiautomatic setup is described which provides the destruction-free measurement of breakdown voltages of thin-film structures for applications like process control and quality prediction. The method of measuring the breakdown voltage consists in feeding a constant current to the thin-film device and analyzing the voltage buildup across the device. This method has been described in a recent paper. The setup provides the successive analysis of breakdown behavior of a given matrix of wafer dots by means of a positioning table, an electropneumatic prober, and a microprocessor-controlled measurement unit via handshake commands. The results are given in a histogram form." @default.
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- W2023798394 date "1979-10-01" @default.
- W2023798394 modified "2023-09-25" @default.
- W2023798394 title "Semiautomatic measurements of thin‐film breakdown voltages" @default.
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- W2023798394 doi "https://doi.org/10.1063/1.1135689" @default.
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