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- W2024245089 abstract "Microchannels used for cooling computer Silicon chips with heat flux boundary condition. Composite microchannels were not studied thoroughly. This paper introduces a new material at the bottom of the silicon ship with different thermal conductivity to enhance the heat flow rate and thus the cooling performance. A geometric model was considered and a numerical code was established to calculate the heat flow rate and Nusselt number at different interfaces of the microchannel. Different parameters were studied: composite materials, different working fluid, cross-sectional area of the composite material, heat flux at the boundary, and the fluid bulk temperature. Results shows how the heat flow rate change with the change of different parameters." @default.
- W2024245089 created "2016-06-24" @default.
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- W2024245089 date "2008-01-01" @default.
- W2024245089 modified "2023-09-26" @default.
- W2024245089 title "Parametric Study for Two-Dimensional Rectangular Composite Microchannel With Heat Flux Boundary Condition" @default.
- W2024245089 doi "https://doi.org/10.1115/icnmm2008-62230" @default.
- W2024245089 hasPublicationYear "2008" @default.
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