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• W2024256857 abstract "Silicon carbide power diodes and transistors are enabling technology for power electronics capable of operating in extreme environments. In this paper, a AgBiX solder paste has been studied for SiC power device die attach to power substrates for 200 °C use in vehicle and downhole well logging applications. The solder paste has a controlled amount of Sn, which limits the amount of Sn intermetallic formation. This produces a stable solder joint as a function of time at high temperature. The die shear strength remained at ~38 MPa through 2000 h of storage at 200 °C. After 1000 thermal cycles from -55°C to 195 °C, the percent die attach area reduction due to solder cracking was <;10%." @default.
• W2024256857 created "2016-06-24" @default.
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• W2024256857 date "2015-02-01" @default.
• W2024256857 modified "2023-10-18" @default.
• W2024256857 title "SiC Power Device Die Attach for Extreme Environments" @default.
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• W2024256857 doi "https://doi.org/10.1109/ted.2014.2358206" @default.
• W2024256857 hasPublicationYear "2015" @default.
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