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- W2024302561 abstract "Abstract In order to examine variations in ribbon thickness along the length or across width of a ribbon, thermal and geometric models are presented for the steady-state growth of EFG ribbon. The principal departures from previous modeling efforts are the incorporation of a linearly tapering meniscus in the thermal modeling of meniscus heat flow, and the introduction of the concept of a thermal resistance in the die tip. The steady-state interface heat balance is then formulated in terms specific to the model chosen. This energy conservation statement is then examined by selecting a steady-state solution as the operating point and examining the neighborhood of steady-states around this point. This is accomplished by calculating the steady-state sensitivities of thickness to changes in die mass temperature and growth speed (∂ t /∂ T a and ∂ t /∂ V , respectively). The behavior of these sensitivities is examined as a function of growth geometry and speed, and an explanation is offered for the generally observed increased meniscus height uniformity with increased speed. In addition, it is shown that the particular models used indicate a region where EFG growth is unstable. Experimental evidence is presented which supports the theoretical findings. Finally, the effect upon growth sensitivity of variations in all growth parameters is examined qualitatively." @default.
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- W2024302561 date "1980-09-01" @default.
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- W2024302561 title "Thermal sensitivity and stability of EFG silicon ribbon growth" @default.
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- W2024302561 doi "https://doi.org/10.1016/0022-0248(80)90235-3" @default.
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