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- W2024303721 abstract "In this paper, we report a microcrack toughening mechanism for enhancing the adhesion of diamond coating. The oriented microcracks were formed within the TiC interlayer to dissipate strain energy and accommodate deformation via the crack opening-closing mechanism, thus enhancing the coating/substrate interfacial toughness. The delamination of diamond coating was effectively prevented when the parallel microcracks were confined within the interlayer and arrested at interfaces of coating/interlayer/substrate. Density functional theory calculations revealed that the highly anisotropic fracture strength of the TiC phase energetically favors crack initiation and propagation along (100) planes only, which are 54.7° away from the interface. These microcracks are constrained inside the interlayer by the two strong interfaces in the substrate/interlayer/coating system. The new microcrack toughening mechanism with these combined features has a wide application to enhance the adhesion of thin-film coatings." @default.
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- W2024303721 date "2009-12-15" @default.
- W2024303721 modified "2023-10-18" @default.
- W2024303721 title "Enhance diamond coating adhesion by oriented interlayer microcracking" @default.
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- W2024303721 doi "https://doi.org/10.1063/1.3267162" @default.
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