Matches in SemOpenAlex for { <https://semopenalex.org/work/W2024306520> ?p ?o ?g. }
- W2024306520 abstract "Demand for off-chip bandwidth has continued to increase. It is projected by the Semiconductor Industry Association in their International Technology Roadmap for Semiconductors that by the year 2015, the chip-to-substrate area-array input-output interconnects will require a pitch of 80 μm. Compliant off-chip interconnects show great potential to address these needs. G-Helix is a lithography-based electroplated compliant interconnect that can be fabricated at the wafer level. G-Helix interconnects exhibit excellent compliance in all three orthogonal directions, and can accommodate the coefficient of thermal expansion (CTE) mismatch between the silicon die and the organic substrate without requiring an underfill. Also, these compliant interconnects are less likely to crack or delaminate the low-k dielectric material in current and future integrated circuits. The interconnects are potentially cost effective because they can be fabricated in batch at the wafer level and using conventional wafer fabrication infrastructure. In this paper, we present an integrative approach, which uses interconnects with varying compliance and thus varying electrical performance from the center to the edge of the die. Using such a varying geometry from the center to the edge of the die, the system performance can be tailored by balancing electrical requirements against thermomechanical reliability concerns. The test vehicle design to assess the reliability and electrical performance of the interconnects is also presented. Preliminary fabrication results for the integrative approach are presented and show the viability of the fabrication procedure. The results from reliability experiments of helix interconnects assembled on an organic substrate are also presented. Initial results from the thermal cycling experiments are promising. Results from mechanical characterization experiments are also presented and show that the out-of-plane compliance exceeds target values recommended by industry experts. Finally, through finite element analysis simulations, it is demonstrated that the die stresses induced by the compliant interconnects are an order of magnitude lower than the die stresses in flip chip on board (FCOB) assemblies, and hence the compliant interconnects are not likely to crack or delaminate low-k dielectric material." @default.
- W2024306520 created "2016-06-24" @default.
- W2024306520 creator A5013434958 @default.
- W2024306520 creator A5034433471 @default.
- W2024306520 creator A5034476855 @default.
- W2024306520 creator A5065677152 @default.
- W2024306520 creator A5085554167 @default.
- W2024306520 date "2007-04-09" @default.
- W2024306520 modified "2023-09-27" @default.
- W2024306520 title "A Heterogeneous Array of Off-Chip Interconnects for Optimum Mechanical and Electrical Performance" @default.
- W2024306520 cites W2018039852 @default.
- W2024306520 cites W2106349405 @default.
- W2024306520 cites W2108365945 @default.
- W2024306520 cites W2132772967 @default.
- W2024306520 cites W2162539651 @default.
- W2024306520 cites W2171825402 @default.
- W2024306520 doi "https://doi.org/10.1115/1.2804096" @default.
- W2024306520 hasPublicationYear "2007" @default.
- W2024306520 type Work @default.
- W2024306520 sameAs 2024306520 @default.
- W2024306520 citedByCount "8" @default.
- W2024306520 countsByYear W20243065202013 @default.
- W2024306520 countsByYear W20243065202015 @default.
- W2024306520 countsByYear W20243065202016 @default.
- W2024306520 countsByYear W20243065202018 @default.
- W2024306520 crossrefType "journal-article" @default.
- W2024306520 hasAuthorship W2024306520A5013434958 @default.
- W2024306520 hasAuthorship W2024306520A5034433471 @default.
- W2024306520 hasAuthorship W2024306520A5034476855 @default.
- W2024306520 hasAuthorship W2024306520A5065677152 @default.
- W2024306520 hasAuthorship W2024306520A5085554167 @default.
- W2024306520 hasConcept C100460472 @default.
- W2024306520 hasConcept C111106434 @default.
- W2024306520 hasConcept C119599485 @default.
- W2024306520 hasConcept C121332964 @default.
- W2024306520 hasConcept C123745756 @default.
- W2024306520 hasConcept C127413603 @default.
- W2024306520 hasConcept C136525101 @default.
- W2024306520 hasConcept C142724271 @default.
- W2024306520 hasConcept C158802814 @default.
- W2024306520 hasConcept C160671074 @default.
- W2024306520 hasConcept C163258240 @default.
- W2024306520 hasConcept C165005293 @default.
- W2024306520 hasConcept C171250308 @default.
- W2024306520 hasConcept C192562407 @default.
- W2024306520 hasConcept C204787440 @default.
- W2024306520 hasConcept C24326235 @default.
- W2024306520 hasConcept C2779227376 @default.
- W2024306520 hasConcept C2780288131 @default.
- W2024306520 hasConcept C41008148 @default.
- W2024306520 hasConcept C43214815 @default.
- W2024306520 hasConcept C45632049 @default.
- W2024306520 hasConcept C49040817 @default.
- W2024306520 hasConcept C530198007 @default.
- W2024306520 hasConcept C59088047 @default.
- W2024306520 hasConcept C62520636 @default.
- W2024306520 hasConcept C68928338 @default.
- W2024306520 hasConcept C71924100 @default.
- W2024306520 hasConcept C76155785 @default.
- W2024306520 hasConcept C79072407 @default.
- W2024306520 hasConceptScore W2024306520C100460472 @default.
- W2024306520 hasConceptScore W2024306520C111106434 @default.
- W2024306520 hasConceptScore W2024306520C119599485 @default.
- W2024306520 hasConceptScore W2024306520C121332964 @default.
- W2024306520 hasConceptScore W2024306520C123745756 @default.
- W2024306520 hasConceptScore W2024306520C127413603 @default.
- W2024306520 hasConceptScore W2024306520C136525101 @default.
- W2024306520 hasConceptScore W2024306520C142724271 @default.
- W2024306520 hasConceptScore W2024306520C158802814 @default.
- W2024306520 hasConceptScore W2024306520C160671074 @default.
- W2024306520 hasConceptScore W2024306520C163258240 @default.
- W2024306520 hasConceptScore W2024306520C165005293 @default.
- W2024306520 hasConceptScore W2024306520C171250308 @default.
- W2024306520 hasConceptScore W2024306520C192562407 @default.
- W2024306520 hasConceptScore W2024306520C204787440 @default.
- W2024306520 hasConceptScore W2024306520C24326235 @default.
- W2024306520 hasConceptScore W2024306520C2779227376 @default.
- W2024306520 hasConceptScore W2024306520C2780288131 @default.
- W2024306520 hasConceptScore W2024306520C41008148 @default.
- W2024306520 hasConceptScore W2024306520C43214815 @default.
- W2024306520 hasConceptScore W2024306520C45632049 @default.
- W2024306520 hasConceptScore W2024306520C49040817 @default.
- W2024306520 hasConceptScore W2024306520C530198007 @default.
- W2024306520 hasConceptScore W2024306520C59088047 @default.
- W2024306520 hasConceptScore W2024306520C62520636 @default.
- W2024306520 hasConceptScore W2024306520C68928338 @default.
- W2024306520 hasConceptScore W2024306520C71924100 @default.
- W2024306520 hasConceptScore W2024306520C76155785 @default.
- W2024306520 hasConceptScore W2024306520C79072407 @default.
- W2024306520 hasLocation W20243065201 @default.
- W2024306520 hasOpenAccess W2024306520 @default.
- W2024306520 hasPrimaryLocation W20243065201 @default.
- W2024306520 hasRelatedWork W1515965320 @default.
- W2024306520 hasRelatedWork W1600708258 @default.
- W2024306520 hasRelatedWork W2004728120 @default.
- W2024306520 hasRelatedWork W2009801949 @default.
- W2024306520 hasRelatedWork W2038124782 @default.
- W2024306520 hasRelatedWork W2051909620 @default.
- W2024306520 hasRelatedWork W2117988687 @default.
- W2024306520 hasRelatedWork W2291535153 @default.