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- W2024392927 abstract "Observations from assorted current stressing experiments on flip-chip solder joints imply that the Cu content in a solder joint system plays a dominant role in its electromigration reliability. In this paper, electromigration reliability of various flip-chip solder joint systems including different substrate pad finishes and solder compositions is summarized to demonstrate the effect of the Cu content. A unified failure mechanism is proposed based on morphologies observed in the current-stressed solder joints with different substrate pad finishes and different solder compositions." @default.
- W2024392927 created "2016-06-24" @default.
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- W2024392927 date "2008-12-01" @default.
- W2024392927 modified "2023-09-23" @default.
- W2024392927 title "Electromigration Reliability with Respect to Cu Content in Solder Joint System" @default.
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- W2024392927 doi "https://doi.org/10.1109/eptc.2008.4763586" @default.
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