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• W2024550131 abstract "This work is designed to study crack development and resistance changes in aluminum thin films under stretching. Crack development and relative electrical resistance change (∆R/R0) of aluminum thin film on 127-μm poly ethylene terephthalate substrates were investigated as a function of engineering strain. Four thicknesses were considered for the aluminum thin films: 50, 100, 200, and 500 nm. The engineering stress–engineering strain curves were very similar for all thicknesses. Three strain rates were considered in this study: 0.1 min− 1, 0.5 min− 1 and 1.0 min− 1. Before the yield point, there was no stress difference under different strain rates. However, after the yield point, stress was higher at a higher strain rate. It was found that ∆R/R0 was very sensitive to the film thickness. Optical microscope images at high magnification showed that cracks were observed at 2% strain for 100, 200, and 500 nm-thick films and at 8% strain for the 50 nm-thick films. Short lateral cracks (perpendicular to the original cracks) were observed at 20% strain for the 100 and 200 nm thick films and at 30% for the 500 nm thick films." @default.
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• W2024550131 date "2011-09-01" @default.
• W2024550131 modified "2023-10-16" @default.
• W2024550131 title "A study on crack propagation and electrical resistance change of sputtered aluminum thin film on poly ethylene terephthalate substrate under stretching" @default.
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• W2024550131 doi "https://doi.org/10.1016/j.tsf.2011.06.062" @default.
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