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- W2024742004 abstract "To simulate the whole process of anodic bonding accurately, this paper makes the research on the current of anodic bonding with area and point cathode respectively. Based on the known models of anodic bonding, novel current formulas are deduced for anodic bonding with area cathode by means of the relation between glass resistivity and temperature. After calibrated by statistics of experimental data, the formulas quantitatively describe the relation between bonding current with time, as well as bonding voltage and bonding temperature. Further, using spreading model of anodic bonding, an approach to dealing with the problem of point cathode current is presented. The experiments prove that the current formulas from the approach are able to indicate the law of point cathode current." @default.
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- W2024742004 date "2011-03-01" @default.
- W2024742004 modified "2023-09-26" @default.
- W2024742004 title "Current Formulas of Silicon-Glass Anodic Bonding" @default.
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- W2024742004 doi "https://doi.org/10.4028/www.scientific.net/amr.216.278" @default.
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