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• W2024931412 abstract "An Ultra-fast Multiwavelength Ellipsometer with 16 different wavelengths (UMWE), was used to monitor and study: (i) the ion etching of c-Si substrate, and the subsequent formation of an amorphous Si(α-Si) overlayer and (ii) the TiNx film growth, with a Ti interlayer on Si substrate, during deposition. The ellipsometer was adapted on a high vacuum chamber system and the films were deposited with the unbalanced magnetron sputtering deposition technique. UMWE measurements were performed to study the multi-spectral response and time dependence of dielectric function ε(ω)(=ε1+iε2) in the energy region 1.54–4.32 eV in terms of process parameters, ion energy (substrate bias Vb) and N2 content in the plasma. By analysing the ‘real-time’ spectra we estimated the amorphization rate of Si, the thickness and the structure of α-Si overlayer, as well as the TiNx thickness and stoichiometry during deposition. The latter is directly related to the plasma frequency ωp, the energy where ε1(ωp)=0, that depends on Vb and N2 content." @default.
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• W2024931412 date "2000-03-01" @default.
• W2024931412 modified "2023-09-27" @default.
• W2024931412 title "‘Real-time’ multiwavelength ellipsometry diagnostics for monitoring dry etching of Si and TiN deposition" @default.
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• W2024931412 doi "https://doi.org/10.1016/s0040-6090(99)00933-5" @default.
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