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- W2024962004 abstract "The increasing demands concerning formaldehyde content in/emission from particleboards force search after alternative bonding agents. One of such bonding agents can be polivinyloacetate (PVAc) glue. Unfortunately its high viscosity makes it difficult to apply the glue using methods for urea-formaldehyde glues. The viscosity change as dry mass decreases can be the reason for low strength of particleboards produced with such glue. The results show that bending strength and internal bond strength of particleboards produced with the use of PVAc glue is lower than for panels produced with the use of UF resin." @default.
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- W2024962004 date "2009-01-01" @default.
- W2024962004 modified "2023-09-24" @default.
- W2024962004 title "PVAc glue as a binding agent in particleboards." @default.
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