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- W2025251145 abstract "Abstract The effects of 0.15, 0.4 and 0.7 wt.% Sb additions on the microstructure and impression creep behavior of the as-cast Mg–5 wt.% Sn alloy were investigated. The dendritic structure of the base alloy was refined after Sb additions, the effect being more pronounced in Mg–5%Sn–0.4%Sb. This alloy had the highest creep resistance among all materials tested, mainly due to the simultaneous formation of the thermally stable Mg 3 Sb 2 and Mg 2 Sn second phase particles which strengthen both matrix and grain boundaries during creep deformation in the investigated system. Impression creep tests were performed in the temperature range 423–523 K and under punching stresses in the range 150–475 MPa for dwell times up to 3600 s. The creep behavior can be divided into two stress regimes, with a change from the low-stress regime to the high-stress regime occurring, depending on the test temperature, around 0.012 σ / G )" @default.
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- W2025251145 date "2010-01-01" @default.
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- W2025251145 title "Effects of Sb additions on the microstructure and impression creep behavior of a cast Mg–5Sn alloy" @default.
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- W2025251145 doi "https://doi.org/10.1016/j.msea.2009.08.056" @default.
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