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- W2025264230 abstract "Abstract Rutherford back‐scattering spectrometry (RBS) and secondary ion mass spectrometry (SIMS) were used to characterize tungsten silicide (WSi x ) which had been chemical vapor deposited using higher‐than‐normal temperatures and a new reactant. Silicon wafers were subjected to a flowing mixture of dichlorosilane (SiH 2 Cl 2 ) and tungsten hexafluoride (WF 6 ) with temperatures ranging from 450°C to 650°C. The conventional process uses SiH 4 and WF 6 with temperatures from 250°C to 400°C. RBS analysis was performed on a matrix of samples produced to show silicon‐to‐tungsten ratios as functions of various deposition temperatures and reactant gas flow ratios. The Si/W ratios obtained ranged from 2.0 to 2.8 over the 450–650°C temperature range. SIMS analysis provided the chlorine and fluorine distributions in the WSi x films, again as functions of various deposition temperatures and flow ratios. This data showed fluorine concentrations on the order of 1 × 10 16 − 4 × 10 18 cm −3 , which are far lower than those concentrations observed for the conventional WF 6 /SiH 4 chemistry (about 1 × 10 20 cm −3 )." @default.
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- W2025264230 date "1989-01-01" @default.
- W2025264230 modified "2023-09-24" @default.
- W2025264230 title "RBS and SIMS characterization of tungsten silicide deposited by using dichlorosilane and tungsten hexafluoride" @default.
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- W2025264230 doi "https://doi.org/10.1002/sia.740140105" @default.
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