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• W2025313931 abstract "Two different flip chip bump configurations have been investigated in terms of their thermo-mechanical, electromigration and fusing behaviour. Standard SAC (SnAgCu) solder bumps with a Ni/Au finish on the chip side are compared with Cu pillar bumps soldered with a thin layer of SnAg alloy. For the test structure, the flip chip assembly is integrated in a BGA package. Finite Element Modelling is used to support the experimental work and explain some of the conclusions." @default.
• W2025313931 created "2016-06-24" @default.
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• W2025313931 date "2011-04-01" @default.
• W2025313931 modified "2023-10-01" @default.
• W2025313931 title "Electromigration, fuse and thermo-mechanical performance of solder bump versus Cu pillar flip chip assemblies" @default.
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• W2025313931 doi "https://doi.org/10.1109/esime.2011.5765847" @default.
• W2025313931 hasPublicationYear "2011" @default.
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