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- W2025408077 abstract "The tensile testing of SiO2 and Si3N4 films was carried out on a silicon chip. The silicon chip has an integrated tensile testing system containing a thin-film specimen and a loading mechanism. We developed fabrication processes of the testing chips for SiO2 and Si3N4 films. The SiO2 specimen was fabricated by thermally oxidizing a single-crystal silicon specimen made from a silicon-on-insulator (SOI) wafer. The Si3N4 specimen was fabricated from an LPCVD film deposited on a silicon wafer. The measured Young's moduli of SiO2 and Si3N4 were 74 and 370 GPa, respectively." @default.
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- W2025408077 date "2000-05-01" @default.
- W2025408077 modified "2023-10-01" @default.
- W2025408077 title "Tensile testing of SiO2 and Si3N4 films carried out on a silicon chip" @default.
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- W2025408077 doi "https://doi.org/10.1016/s0924-4247(99)00364-7" @default.
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