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• W2025451303 abstract "A silicon nitride ceramic is prepared by a modified sintering of reaction bonded silicon nitride method (SRBSN). This ceramic has a very high thermal conductivity, high fracture toughness, and a high strength. It is expected to be used as the next-generation insulating substrate material for high-power electronic devices and other new applications." @default.
• W2025451303 created "2016-06-24" @default.
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• W2025451303 date "2011-09-08" @default.
• W2025451303 modified "2023-10-06" @default.
• W2025451303 title "A Tough Silicon Nitride Ceramic with High Thermal Conductivity" @default.
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• W2025451303 doi "https://doi.org/10.1002/adma.201102462" @default.
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