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• W2025968904 abstract "A water-quenching technique was used to evaluate the thermal-shock strength behavior of silicon nitride (Si3N4) ceramics in an air atmosphere. When the tensile surface was shielded from air during the heating and soaking process, the quenched specimens showed a gradual decrease in strength at temperatures above 600°C. However, the specimens with the air-exposed surface exhibited a ∼16% and ∼29% increase in strength after quenching from 800° and 1000°C, respectively. This is because of the occurrence of surface oxidation, which may cause the healing of surface cracks and the generation of surface compressive stresses. As a result, some preoxidation of Si3N4 components before exposure to a thermal-shock environment is recommended in practical applications." @default.
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• W2025968904 date "2003-09-01" @default.
• W2025968904 modified "2023-10-08" @default.
• W2025968904 title "Strength of Silicon Nitride after Thermal Shock" @default.
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• W2025968904 doi "https://doi.org/10.1111/j.1151-2916.2003.tb03527.x" @default.
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