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• W2026950554 abstract "As through silicon via (TSV) technology is in the spotlight as the vertical interconnection method for 3-dimensional integrated circuit (3D IC), the study about a new structure of the 3-dimensional TSV clock distribution network (3D CDN) is strongly needed. In this paper, we propose a new 3D CDN scheme, vertical tree 3D CDN (VT 3D CDN), to reduce the skew, and we analyze the performances which is the skew, the jitter, the power consumption and the area consumption. The proposed VT 3D CDN improves the performance of the skew, although the other performance is slightly degraded." @default.
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• W2026950554 date "2012-05-01" @default.
• W2026950554 modified "2023-09-26" @default.
• W2026950554 title "Vertical tree 3-dimensional TSV clock distribution network in 3D IC" @default.
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• W2026950554 doi "https://doi.org/10.1109/ectc.2012.6249105" @default.
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