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• W2027096508 abstract "This paper describes a solid-state image sensor for high-speed X-ray imaging. The sensor is made up of a light sensitive detector layer bump-bonded to a readout integrated circuit (ROIC). The detector layer is high resistivity n-type silicon and is fully depleted in operation. The p-implanted islands are used to define pixel regions with 100-μm × 100-μm area. The detector layer contains 852 × 209 pixels indium bump-bonded to four identical CMOS ROICs. Each ROIC contains 213 × 209 pixels and is fabricated using a 0.25-μm CMOS process. The ROIC utilizes a capacitive transimpedance amplifier-type front-end coupled to a switched capacitor analog memory. This architecture allows storage of eight frames for high-speed burst imaging of up to a million frames per second, followed by a slower multiplexed readout. Details of the sensor design and operation are presented together with characterization results." @default.
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• W2027096508 date "2015-03-01" @default.
• W2027096508 modified "2023-10-16" @default.
• W2027096508 title "A High Frame Rate Hybrid X-Ray Image Sensor" @default.
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• W2027096508 doi "https://doi.org/10.1109/jsen.2014.2359153" @default.
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